10AS066K3F35I3SGES
| Parameters | |
|---|---|
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FC (35x35) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | Arria 10 SX |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 396 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 660K Logic Elements |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.There is a 1152-BBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides reliable operation.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.It is part of the Arria 10 SX series of system on a chips.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.In addition, this SoC security combines FPGA - 660K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 396 I/Os.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Intel
10AS066K3F35I3SGES System On Chip (SoC) applications.
- Self-aware system-on-chip (SoC)
- POS Terminals
- Remote control
- Communication interfaces ( I2C, SPI )
- Multiprocessor system-on-chips (MPSoCs)
- Keyboard
- Embedded systems
- Measurement testers
- Avionics
- Microcontroller
