1SX250LH3F55E2VG
| Parameters | |
|---|---|
| Package / Case | 2912-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Series | Stratix® 10 SX |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 1160 |
| Speed | 1.5GHz |
| RAM Size | 256KB |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR CIRCUIT |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 2500K Logic Elements |
| RoHS Status | RoHS Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight? is used to build this SoC.It has been assigned a package 2912-BBGA, FCBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.The system on a chip is part of the series Stratix? 10 SX.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 2500K Logic Elements.In the state-of-the-art Tray package, this SoC system on a chip is housed.As a whole, this SoC part includes 1160 I/Os.As its uPs/uCs/Peripheral SoC, it uses MICROPROCESSOR CIRCUIT.
Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Intel
1SX250LH3F55E2VG System On Chip (SoC) applications.
- Transmitters
- RISC-V
- POS Terminals
- Personal Computers
- AC-input BLDC motor drive
- Smart appliances
- Apple smart watch
- Healthcare
- Networked sensors
- Automotive
