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1SX250LN2F43E1VG

0°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O


  • Manufacturer: Intel
  • Nocochips NO: 386-1SX250LN2F43E1VG
  • Package: 1760-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 152
  • Description: 0°C~100°C TJ System On ChipStratix? 10 SX Series 688 I/O(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 1760-BBGA, FCBGA
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Stratix® 10 SX
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of I/O 688
Speed 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™
Peripherals DMA, WDT
Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes FPGA - 2500K Logic Elements
RoHS Status RoHS Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight? core processor(s) is built into this SoC.Package 1760-BBGA, FCBGA is assigned to this system on a chip by the manufacturer.With 256KB RAM implemented, this SoC chip provides users with a high level of performance.A MCU, FPGA technique is used for the SoC design's internal architecture.Stratix? 10 SX is the series in which this system on chip SoC falls under.This SoC meaning should have an average operating temperature of 0°C~100°C TJ when it is operating normally.There is one thing to note about this SoC security: it combines FPGA - 2500K Logic Elements.This SoC system on a chip has been designed in a state-of-the-art Tray package.688 I/Os are included in this SoC part.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.

Quad ARM? Cortex?-A53 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Intel


1SX250LN2F43E1VG System On Chip (SoC) applications.

  • Industrial automation devices
  • Industrial AC-DC
  • High-end PLC
  • Mobile computing
  • String inverter
  • Communication interfaces ( I2C, SPI )
  • Robotics
  • Smartphone accessories
  • Three phase UPS
  • RISC-V

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