2327678-3
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Material | Copper Alloy |
| Mounting Type | Surface Mount |
| Material - Insulation | Liquid Crystal Polymer (LCP) |
| Operating Temperature | -55°C~85°C |
| Packaging | Tape & Reel (TR) |
| Series | Sliver 2.0 |
| Feature | Board Guide, Pick and Place, Solder Retention |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | Not Applicable |
| Termination | Solder |
| Number of Positions | 84 |
| Color | Black |
| Number of Rows | 2 |
| Gender | Female |
| Pitch | 0.024 0.60mm |
| Contact Finish | Gold |
| Card Type | Non Specified - Dual Edge |
| Read Out | Dual |
| Number of Positions/Bay/Row | 28; 14 |
| Contact Finish Thickness | 30.0μin 0.76μm |
| Card Thickness | 0.062 1.57mm |
| RoHS Status | RoHS Compliant |
2327678-3 Overview
Tape & Reel (TR) wanted the material packaged as per his specs.There is a recommendation for mounting type Surface Mount.This device has Board Guide, Pick and Place, Solder Retention features.Sliver 2.0 shows the device's series.
2327678-3 Features
Sliver 2.0 series
2327678-3 Applications
There are a lot of TE Connectivity AMP Connectors 2327678-3 Edgeboard Connectors applications.
- Displaying
- 4-channel data acquisition
- Microcontrollers.
- Industrial Process Control
- 3-phase power control
- TD-SCDMA, WiMAX
- Broadband data applications
- Digital Storage Oscilloscope
- High Speed Data Acquisition for PCs
- Wireless local loop
