A2F060M3E-1FG256I
| Parameters | |
|---|---|
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion® |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.5V |
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Base Part Number | A2F060M3E |
| Number of Outputs | 66 |
| Operating Supply Voltage | 1.5V |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Number of I/O | MCU - 26, FPGA - 66 |
| RAM Size | 16KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Logic Blocks (LABs) | 8 |
| Speed Grade | 1 |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Number of Registers | 1536 |
| Number of Equivalent Gates | 60000 |
| Flash Size | 128KB |
| Radiation Hardening | No |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.There is a 256-LBGA package assigned to this system on a chip by the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series SmartFusion?.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.It is important to note that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are included in this SoC part.Use a power supply with a voltage of 1.5V if possible.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.As a result, there are 256 terminations in total, which does really benefit system on a chip.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 66 outputs.A flashing 128KB appears on it.Search A2F060M3E for system on chips with similar specs and purposes.100MHz is the wireless SoC's frequency.This SoC meaning utilizes a core architecture of ARM as its foundation.256 pins are present on this computer SoC.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
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