A2F060M3E-1FGG256I
| Parameters | |
|---|---|
| Package / Case | 256-LBGA |
| Surface Mount | YES |
| Number of Pins | 256 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e1 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | 250 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 1mm |
| Frequency | 100MHz |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Base Part Number | A2F060M3E |
| Number of Outputs | 66 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.575V |
| Supply Voltage-Min (Vsup) | 1.425V |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Number of I/O | MCU - 26, FPGA - 66 |
| RAM Size | 16KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Organization | 1536 CLBS, 60000 GATES |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Number of Logic Blocks (LABs) | 8 |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Number of Equivalent Gates | 60000 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.7mm |
| Length | 17mm |
| Width | 17mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops together.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of MCU - 26, FPGA - 66 I/Os.Ideally, a power supply with a voltage of 1.5V should be used.In the SoCs wireless, high voltages above 1.575V are considered dangerous and should not be used.There is a possibility that it can be powered by a power supply of at least 1.425V.FIELD PROGRAMMABLE GATE ARRAY can be re-configured to serve different design needs.system on a chip benefits from 256 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.There are 66 outputs available on this SoC.There is a flash of 128KB on it.You can get system on chips with similar specs and purposes by searching A2F060M3E.wireless SoCs operate at 100MHz.Based on the core architecture of ARM, the SoC meaning has a high level of performance.256 pins are present on this computer SoC.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1FGG256I System On Chip (SoC) applications.
- Measurement testers
- Wireless sensor networks
- Multiprocessor system-on-chips (MPSoCs)
- Deep learning hardware
- Keyboard
- Networked sensors
- Mobile market
- Automated sorting equipment
- Self-aware system-on-chip (SoC)
- Networked sensors
