Parameters |
Package / Case |
144-LQFP |
Supplier Device Package |
144-TQFP (20x20) |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion® |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Max Operating Temperature |
100°C |
Min Operating Temperature |
-40°C |
Frequency |
100MHz |
Base Part Number |
A2F060M3E |
Interface |
EBI/EMI, I2C, SPI, UART, USART |
Number of I/O |
MCU - 21, FPGA - 33 |
Speed |
100MHz |
RAM Size |
16KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DMA, POR, WDT |
Connectivity |
EBI/EMI, I2C, SPI, UART/USART |
Architecture |
MCU, FPGA |
Core Architecture |
ARM |
Primary Attributes |
ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
Flash Size |
128KB |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 144-LQFP package as per the manufacturer's specifications.With 16KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.In the SmartFusion? series, this system on chip SoC is included.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.Tray package houses this SoC system on a chip.MCU - 21, FPGA - 33 I/Os in total are included in this SoC part.This flash has a size of 128KB.A2F060M3E will give you system on chips with similar specifications and purposes.A frequency of 100MHz is used by the wireless SoC to operate.Core architecture of ARM underpins the SoC meaning.It is just enough to start the SoC computing at -40°C.There is a maximum operating temperature of 100°C set for this SoC system on chip during its design.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-1TQ144I System On Chip (SoC) applications.
- Mobile market
- Video Imaging
- Three phase UPS
- Multiprocessor system-on-chips (MPSoCs)
- Industrial
- Industrial automation devices
- Temperature
- sequence controllers
- ARM processors
- Digital Media