A2F060M3E-TQ144
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 144-LQFP |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion® |
| JESD-609 Code | e0 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 144 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | QUAD |
| Terminal Form | GULL WING |
| Peak Reflow Temperature (Cel) | 225 |
| Supply Voltage | 1.5V |
| Terminal Pitch | 0.5mm |
| Frequency | 80MHz |
| Time@Peak Reflow Temperature-Max (s) | 20 |
| Base Part Number | A2F060M3E |
| JESD-30 Code | S-PQFP-G144 |
| Number of Outputs | 33 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.575V |
| Power Supplies | 1.51.82.53.3V |
| Supply Voltage-Min (Vsup) | 1.425V |
| Interface | EBI/EMI, I2C, SPI, UART, USART |
| Number of I/O | MCU - 21, FPGA - 33 |
| RAM Size | 16KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Number of Inputs | 33 |
| Organization | 1536 CLBS, 60000 GATES |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops |
| Number of Equivalent Gates | 60000 |
| Flash Size | 128KB |
| Height Seated (Max) | 1.6mm |
| Length | 20mm |
| Width | 20mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.According to the manufacturer, this system on a chip has a package of 144-LQFP.With 16KB RAM implemented, this SoC chip provides reliable operation.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be 0°C~85°C TJ.This SoC security combines ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops and that is something to note.In the state-of-the-art Tray package, this SoC system on a chip is housed.This SoC part contains a total of MCU - 21, FPGA - 33 I/Os in total.Ideally, a power supply with a voltage of 1.5V should be used.There are voltages higher than 1.575V that should be avoided when using the SoCs wireless.As a minimum, the power supply of the SoC system on a chip needs to be 1.425V.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.system on a chip benefits from 144 terminations.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.It is possible to use this SoC chip with 33 outputs.A power supply of 1.51.82.53.3V is required to run system on chip.A SoC chip with 33 inputs is available.The flash is set to 128KB.By searching A2F060M3E, you will find system on chips with similar specs and purposes.wireless SoCs operate at 80MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.
ARM? Cortex?-M3 processor.
16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
A2F060M3E-TQ144 System On Chip (SoC) applications.
- Mobile market
- Keywords
- Industrial automation devices
- Flow Sensors
- Personal Computers
- Efficient hardware for training of neural networks
- Temperature Sensors
- USB hard disk enclosure
- Medical
- Mouse
