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A2F200M3F-CSG288

0°C~85°C TJ A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-A2F200M3F-CSG288
  • Package: 288-TFBGA, CSPBGA
  • Datasheet: PDF
  • Stock: 441
  • Description: 0°C~85°C TJ A2F200 System On ChipSmartFusion? Series MCU - 31, FPGA - 78 I/O(Kg)

Details

Tags

Parameters
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
RoHS Status RoHS Compliant
Factory Lead Time 1 Week
Package / Case 288-TFBGA, CSPBGA
Supplier Device Package 288-CSP (11x11)
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F200
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Number of I/O MCU - 31, FPGA - 78
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.Assigned with the package 288-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion? is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.Taking note of the fact that this SoC security combines ProASIC?3 FPGA, 200K Gates, 4608 D-Flip-Flops is important.Tray package houses this SoC system on a chip.As a whole, this SoC part includes MCU - 31, FPGA - 78 I/Os.As for its flash size, it is 256KB.You can get system on chips with similar specs and purposes by searching A2F200.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.The SoC meaning is based on the core architecture of ARM.Just 0°C is needed to get the SoC computing up and running.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 85°C.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F200M3F-CSG288 System On Chip (SoC) applications.

  • Microprocessors
  • Smartphone accessories
  • Mobile computing
  • Body control module
  • Mobile market
  • Industrial automation devices
  • Keyboard
  • Optical drive
  • Measurement testers
  • Digital Media

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