A2F500M3G-1FG256IX94
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FPBGA (17x17) |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Series | SmartFusion® |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Base Part Number | A2F500M3G |
| Number of I/O | MCU - 25, FPGA - 66 |
| Speed | 100MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DMA, POR, WDT |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI, UART/USART |
| Architecture | MCU, FPGA |
| Primary Attributes | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops |
| Flash Size | 512KB |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.Manufacturer assigns package 256-LBGA to this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.SmartFusion? is the series in which this system on chip SoC falls under.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.This SoC security combines ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops, an important feature to keep in mind.This SoC system on a chip has been designed in a state-of-the-art Tray package.An integral part of this SoC consists of a total of MCU - 25, FPGA - 66 I/Os.A 512KB flash can be seen on it.By searching A2F500M3G, you will find system on chips with similar specs and purposes.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
A2F500M3G-1FG256IX94 System On Chip (SoC) applications.
- Video Imaging
- Industrial Pressure
- Vending machines
- sequence controllers
- Avionics
- Deep learning hardware
- ARM processors
- USB hard disk enclosure
- Published Paper
- Central inverter
