Parameters |
Factory Lead Time |
1 Week |
Mounting Type |
Surface Mount |
Package / Case |
176-LQFP Exposed Pad |
Surface Mount |
YES |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
SHARC® |
Pbfree Code |
no |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
176 |
Type |
Fixed/Floating Point |
Technology |
CMOS |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Terminal Pitch |
0.5mm |
Time@Peak Reflow Temperature-Max (s) |
30 |
Pin Count |
176 |
JESD-30 Code |
S-PQFP-G176 |
Interface |
CAN, EBI/EMI, Ethernet, DAI, I2C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FIXED POINT |
Voltage - I/O |
3.30V |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Non-Volatile Memory |
External |
Voltage - Core |
1.10V |
On Chip Data RAM |
1.768MB |
Clock Rate |
300MHz, 300MHz |
Height Seated (Max) |
1.6mm |
Length |
24mm |
Width |
24mm |
RoHS Status |
ROHS3 Compliant |
ADSP-SC571KSWZ-3 Overview
It is a kind of electronic component that comes in a package of 176-LQFP Exposed Pad.Packaging way Tray is provided.Its Fixed/Floating Point status makes it ideal for a wide range of applications.It is mounted in the direction of Surface Mount as shown in the image below.The operation of the device at the temperature of 0°C~70°C TA ensures the normal operation of the device.It refers to the analog voltage range of 3.30V that may be input or output.The SHARC? series contains this digital signal processor.The 176 terminations are used for its uses.Pins are located on the 176 component.
ADSP-SC571KSWZ-3 Features
Supplied in the 176-LQFP Exposed Pad package
ADSP-SC571KSWZ-3 Applications
There are a lot of Analog Devices Inc. ADSP-SC571KSWZ-3 DSP applications.
- Vehicle electronics
- Computers and laptop
- Image compression
- Monitoring equipment
- Automatic analysis system of EEG or ECG
- Digital communications
- Sound navigation and ranging systems
- Spectral density estimation
- Tomography technology
- Financial signals