BFC233660102
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Tin |
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | Radial |
| Terminal Shape | WIRE |
| Number of Pins | 2 |
| Dielectric Material | Polypropylene (PP), Metallized |
| Operating Temperature | -55°C~105°C |
| Packaging | Bulk |
| Published | 2007 |
| Series | MKP336 6 |
| Size / Dimension | 0.492Lx0.157W 12.50mmx4.00mm |
| Tolerance | ±20% |
| JESD-609 Code | e3 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 2 |
| Termination | PC Pins |
| ECCN Code | EAR99 |
| Applications | EMI, RFI Suppression |
| Additional Feature | RATED (AC) VOLTAGE (V): 300 |
| Capacitance | 1000pF |
| Voltage - Rated DC | 630V |
| Depth | 4mm |
| Voltage - Rated AC | 250V |
| Lead Pitch | 10mm |
| Capacitor Type | FILM CAPACITOR |
| Dielectric | PP |
| Lead Spacing | 0.394 10.00mm |
| Insulation Resistance | 15GOhm |
| Rated (DC) Voltage (URdc) | 1000V |
| Lead Diameter | 600 μm |
| Size Code | 4916 |
| Rated (AC) Voltage (URac) | 300V |
| Diameter | 4mm |
| Height | 10mm |
| Height Seated (Max) | 0.394 10.00mm |
| Radiation Hardening | No |
| REACH SVHC | Unknown |
| RoHS Status | ROHS3 Compliant |
| Lead Free | Lead Free |
| Ratings | Y2 |
BFC233660102 Overview
For systems to operate, a rated (DC) voltage (URdc) of 1000V must be applied internally.The device has insulation resistance of 15GOhm.Lead spacing is 0.394 10.00mm for this electrical device.System power requires an AC voltage rating of 300V (URac).The device is capable of operating at the temperature of -55°C~105°C.
BFC233660102 Features
a rated (DC) voltage (URdc) of 1000V
15GOhm insulation resistance
an internal rated (AC) voltage (URac) of 300V
BFC233660102 Applications
There are a lot of Vishay BC Components BFC233660102 applications of film capacitors.
- Switch-mode power supplies
- Bypassing
- IGBT
- Test and measuring equipment
- RFI for automotive
- TV and monitor sets
- Coupling, decoupling
- Mobile communications
- Global positioning systems
- Electronic ballasts
