Parameters | |
---|---|
Number of Terminations | 3 |
ECCN Code | EAR99 |
Terminal Finish | TIN |
Terminal Position | SINGLE |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
Base Part Number | BYV32-150 |
Reference Standard | IEC-60134 |
JESD-30 Code | R-PSFM-T3 |
Operating Temperature (Max) | 150°C |
Number of Elements | 2 |
Speed | Fast Recovery =< 500ns, > 200mA (Io) |
Diode Type | Standard |
Current - Reverse Leakage @ Vr | 30μA @ 150V |
Voltage - Forward (Vf) (Max) @ If | 1.15V @ 20A |
Forward Current | 8A |
Operating Temperature - Junction | 150°C Max |
Application | ULTRA FAST SOFT RECOVERY |
Voltage - DC Reverse (Vr) (Max) | 150V |
Current - Average Rectified (Io) | 20A |
Forward Voltage | 850mV |
Number of Phases | 1 |
Reverse Recovery Time | 25ns |
Rep Pk Reverse Voltage-Max | 150V |
Diode Configuration | 1 Pair Common Cathode |
Reverse Current-Max | 30μA |
RoHS Status | RoHS Compliant |
Mounting Type | Through Hole |
Package / Case | TO-220-3 |
Surface Mount | NO |
Diode Element Material | SILICON |
Packaging | Tube |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |