Parameters |
Mounting Type |
Through Hole |
Package / Case |
24-DIP (0.300, 7.62mm) |
Surface Mount |
NO |
Operating Temperature |
0°C~70°C |
Packaging |
Tube |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
1 (Unlimited) |
Number of Terminations |
24 |
Terminal Finish |
TIN LEAD |
Technology |
CMOS |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
240 |
Supply Voltage |
5V |
Terminal Pitch |
2.54mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
20 |
JESD-30 Code |
R-PDIP-T24 |
Function |
Receive Buffer |
Qualification Status |
COMMERCIAL |
Interface |
TDM |
Number of Circuits |
1 |
Current - Supply |
5mA |
Telecom IC Type |
ELASTIC BUFFER |
Height Seated (Max) |
4.572mm |
Length |
30.545mm |
Width |
7.62mm |
RoHS Status |
ROHS3 Compliant |
DS2176+ Overview
In order to save space on the board, 24-DIP (0.300, 7.62mm) packages are used.In order to pack telecommunications equipment, Tube is used.Telecommunications equipment is mounted with type Through Hole.There are 1 circuits in this telecom IC .0°C~70°C is the operating temperature that can be set for reliable performance.Telecom switching configuration contains 24 terminations.It requires a supply voltage of 5V.It adopts ELASTIC BUFFER as its telecom IC type.Wit h a supply current of 5mA, telecom equipment operates.
DS2176+ Features
Available in the 24-DIP (0.300, 7.62mm) package
ELASTIC BUFFER as telecom IC type
DS2176+ Applications
There are a lot of Rochester Electronics, LLC DS2176+ Telecom applications.
- Dual battery supply voltage SLICs
- Remote wireless modules
- ATM Switches
- Digital Access Cross-connect System (DACs)
- E2 Rates PCM Line Interface
- DECT (Digital European Cordless Telephone) Base
- SONET/SDH terminal
- Interfaces to SONET STS-1 Networks
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- PDH Multiplexers