Parameters |
Mount |
Surface Mount |
Package / Case |
LQFP |
Number of Pins |
144 |
JESD-609 Code |
e3 |
Moisture Sensitivity Level (MSL) |
3 |
Number of Terminations |
144 |
ECCN Code |
3A991.A.2 |
Terminal Finish |
MATTE TIN |
Max Operating Temperature |
95°C |
Min Operating Temperature |
-40°C |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
QUAD |
Terminal Form |
GULL WING |
Peak Reflow Temperature (Cel) |
260 |
Supply Voltage |
1.8V |
Terminal Pitch |
0.5mm |
Frequency |
150MHz |
Time@Peak Reflow Temperature-Max (s) |
40 |
Max Supply Voltage |
3.46V |
Min Supply Voltage |
1.71V |
Memory Size |
120kB |
RAM Size |
69kB |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Frequency (Max) |
150MHz |
Data Bus Width |
24b |
Address Bus Width |
18 |
Boundary Scan |
YES |
Low Power Mode |
YES |
Format |
FIXED POINT |
Barrel Shifter |
YES |
Internal Bus Architecture |
MULTIPLE |
Height Seated (Max) |
1.6mm |
Length |
20mm |
Radiation Hardening |
No |
RoHS Status |
RoHS Compliant |
Lead Free |
Lead Free |
DSPD56367AG150 Overview
Basically, it is a type of electronic component that is available in a LQFP package.There are 144 terminations for its uses.It is supplied with voltage by 1.8V.An overview of its configuration can be found in the section on 144 pins.It is specifically designed to operate with the frequency of 150MHz.It adopts Surface Mount as its mounting way.In order to power this device, a voltage as low as 1.71V needs to be supplied.The maximum voltage supplied to this device amounts to 3.46V.Its memory can store 120kB data.For its uPs/uCs/peripheral ICs, DIGITAL SIGNAL PROCESSOR, OTHER is used.There should be a difference between 95°C and the operating temperature.It should operate at a temperature greater than -40°C.It should have a maximum frequency below 150MHz.
DSPD56367AG150 Features
Supplied in the LQFP package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics
DSPD56367AG150 Applications
There are a lot of NXP Semiconductors / Freescale DSPD56367AG150 DSP applications.
- Electronic information engineering
- House construction
- Seismology
- Biometrics
- Signal processing for telecommunications
- Computers and laptop
- Audio compression
- Airplanes
- Sonar
- Digital hardware