Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Surface Mount |
Mounting Type | Surface Mount |
Package / Case | 8-SOIC (0.154, 3.90mm Width) |
Number of Pins | 8 |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Tape & Reel (TR) |
Published | 2003 |
Series | HEXFET® |
JESD-609 Code | e3 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 8 |
ECCN Code | EAR99 |
Resistance | 100mOhm |
Terminal Finish | Matte Tin (Sn) |
Additional Feature | ULTRA LOW RESISTANCE |
Max Power Dissipation | 2W |
Terminal Position | DUAL |
Terminal Form | GULL WING |
Current Rating | 3.5A |
Base Part Number | IRF7105PBF |
Number of Elements | 2 |
Number of Channels | 2 |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 2W |
Turn On Delay Time | 7 ns |
FET Type | N and P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 100m Ω @ 1A, 10V |
Vgs(th) (Max) @ Id | 3V @ 250μA |
Input Capacitance (Ciss) (Max) @ Vds | 330pF @ 15V |
Current - Continuous Drain (Id) @ 25°C | 3.5A 2.3A |
Gate Charge (Qg) (Max) @ Vgs | 27nC @ 10V |
Rise Time | 13ns |
Polarity/Channel Type | N-CHANNEL AND P-CHANNEL |
Fall Time (Typ) | 37 ns |
Turn-Off Delay Time | 45 ns |
Continuous Drain Current (ID) | 3.5A |
Threshold Voltage | 1V |
Gate to Source Voltage (Vgs) | 20V |
Drain to Source Breakdown Voltage | 25V |
Pulsed Drain Current-Max (IDM) | 14A |
FET Technology | METAL-OXIDE SEMICONDUCTOR |
Max Junction Temperature (Tj) | 150°C |
FET Feature | Standard |
Nominal Vgs | 3 V |
Height | 1.75mm |
Length | 4.9784mm |
Width | 3.9878mm |
Radiation Hardening | No |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |