Parameters |
Package / Case |
448-FBGA Exposed Pad |
Supplier Device Package |
448-PBGA w/Heat Spreader (23x23) |
Operating Temperature |
0°C~70°C TA |
Packaging |
Tray |
Series |
QorlQ LS1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Speed |
650MHz |
Core Processor |
ARM1136JF-S |
Ethernet |
GbE (2) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DDR2 |
USB |
USB 2.0 + PHY (1) |
Additional Interfaces |
I2C, PCIe, PCM/TDM, SPI, UART |
RoHS Status |
ROHS3 Compliant |
LS101MASE7EHA Overview
Shipping overseas is convenient thanks to the embedded microprocessor's packaging in 448-FBGA Exposed Pad. Advanced packaging method Tray is used to provide high reliability. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Identify the operating temperature around 0°C~70°C TA. From the QorlQ LS1 series. With a core count of ARM1136JF-S, this CPU is multicore. There are DDR2 RAM controllers on this CPU. This microprocessor is equipped with an interface of I2C, PCIe, PCM/TDM, SPI, UART. Suppliers are offering 448-PBGA w/Heat Spreader (23x23) packages.
LS101MASE7EHA Features
ARM1136JF-S Core
LS101MASE7EHA Applications
There are a lot of NXP USA Inc. LS101MASE7EHA Microprocessor applications.
- Printers
- DCS control intelligent sensor
- Smoke alarms
- Coffee machines
- Set-top boxes
- Medical instruments chromatographs
- Graphic terminals
- Petrochemical
- Speed meter
- Scanners