Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 1 month ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
233 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
233 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
233 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 10K Logic Modules |
Number of Logic Cells |
12084 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 484-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.This SoC design employs the MCU, FPGA technique for its internal architecture.The system on a chip is part of the series SmartFusion?2.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.In addition, this SoC security combines FPGA - 10K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.233 I/Os are available in this SoC part.A power supply with a 1.2V rating is recommended.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 484 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.The SoC chip that comes with this module can be configured to have 233 outputs.A power supply of 1.2V is required.This SoC chip has a total of 233 inputs that can be used.12084 logic cells are present in logic system on chips.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S010-FG484I System On Chip (SoC) applications.
- Mouse
- Industrial automation devices
- Efficient hardware for training of neural networks
- Apple smart watch
- Medical Pressure
- Self-aware system-on-chip (SoC)
- Transmitters
- Fitness
- Smart appliances
- Vending machines