M2S025-1FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 25K Logic Modules |
| Number of Logic Cells | 27696 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.Assigned with the package 325-TFBGA, CSPBGA, this system on a chip comes from the manufacturer.A 64KB RAM SoC chip provides reliable performance to users.Internally, this SoC design uses the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.As one of the most important things to note is that this SoC security combines FPGA - 25K Logic Modules together.There is a state-of-the-art Tray package that houses this SoC system on a chip.An integral part of this SoC consists of a total of 180 I/Os.It is recommended to use a 1.2V power supply.The SoCs wireless is considered unreliable if the voltage exceeds 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 325 terminations.Furthermore, it has a remarkable system on a chip capability, much like other high-quality Field Programmable Gate Arrays.A SoC chip with 180 outputs is available.You will need to provide 1.2V power supplies in order to run system on chip.The SoC chip offers 180 inputs.There are 27696 logic cells in the logic system on chips.As for its flash size, it is 256KB.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025-1FCSG325I System On Chip (SoC) applications.
- Special Issue Editors
- Keywords
- Sensor network-on-chip (sNoC)
- Industrial transport
- Industrial automation devices
- AC-input BLDC motor drive
- Central alarm system
- Functional safety for critical applications in the industrial sectors
- Mobile market
- POS Terminals
