M2S025TS-VF256
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 256-LFBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 256 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.8mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B256 |
| Number of Outputs | 138 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 138 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 138 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 25K Logic Modules |
| Number of Logic Cells | 27696 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.56mm |
| Length | 14mm |
| Width | 14mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Assigned with the package 256-LFBGA, this system on a chip comes from the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.In terms of internal architecture, this SoC design uses the MCU, FPGA method.It is part of the SmartFusion?2 series of system on a chips.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.A key point to note is that this SoC security combines FPGA - 25K Logic Modules.Tray package houses this SoC system on a chip.As a whole, this SoC part includes 138 I/Os.It is advised to utilize a 1.2V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.26V.This SoC system on a chip can run on a power supply that is at least 1.14V.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.In total, there are 256 terminations, so system on a chip is really aided by this.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.In order for this SoC chip to work properly, you can have 138 outputs.System on chip requires 1.2V power supplies.The SoC chip is equipped with 138 inputs.27696 logic cells are present in logic system on chips.There is a flash of 256KB.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S025TS-VF256 System On Chip (SoC) applications.
- System-on-chip (SoC)
- Video Imaging
- Networked sensors
- Multiprocessor system-on-chips (MPSoCs)
- sequence controllers
- Measurement tools
- Automotive gateway
- Industrial transport
- Industrial
- Self-aware system-on-chip (SoC)
