M2S050-FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 50K Logic Modules |
| Number of Logic Cells | 56340 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
There are ARM? Cortex?-M3 core processors in this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.SmartFusion?2 is the series in which this system on chip SoC falls under.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines FPGA - 50K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 200.Use a power supply with a voltage of 1.2V if possible.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.Having 325 terminations in total makes system on a chip possible.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.You can have 200 user outputs for this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.Inputs are available on the SoC chip in the number of 200.A logic SoC has 56340 logic cells.It has a 256KB flash.Moreover, this SoC processor comes with LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S050-FCSG325I System On Chip (SoC) applications.
- Cyberphysical system-on-chip
- Industrial robot
- Self-aware system-on-chip (SoC)
- Communication network-on-Chip (cNoC)
- Multiprocessor system-on-chips (MPSoCs)
- ARM processors
- POS Terminals
- Video Imaging
- Three phase UPS
- Smartphones
