Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
484-BGA |
Supplier Device Package |
484-FPBGA (23x23) |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Primary Attributes |
FPGA - 50K Logic Modules |
Flash Size |
256KB |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.Package 484-BGA is assigned to this system on a chip by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.When it comes to internal architecture, this SoC design employs the MCU, FPGA technique.It is part of the SmartFusion?2 series of system on a chips.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.It is important to note that this SoC security combines FPGA - 50K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.267 I/Os are included in this SoC part.This flash has a size of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-1FGG484 System On Chip (SoC) applications.
- High-end PLC
- Personal Computers
- Microcontroller based SoC ( RISC-V, ARM)
- Medical
- Sports
- Mobile computing
- Three phase UPS
- Smartphones
- Networked sensors
- POS Terminals