Parameters |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B896 |
Number of Outputs |
377 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
377 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
377 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 50K Logic Modules |
Number of Logic Cells |
56340 |
Flash Size |
256KB |
Height Seated (Max) |
2.44mm |
Length |
31mm |
Width |
31mm |
RoHS Status |
RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 2 weeks ago) |
Package / Case |
896-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
896 |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A ARM? Cortex?-M3 core processor(s) is built into this SoC.This system on a chip is packaged as 896-BGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with reliable performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.A system on chip SoC of this type belongs to the SmartFusion?2 series.In general, this SoC meaning should operate at a temperature of -40°C~100°C TJ on a regular basis.As one of the most important things to note is that this SoC security combines FPGA - 50K Logic Modules together.It comes in a state-of-the-art Tray package.This SoC part contains a total of 377 I/Os in total.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supplies of at least 1.14V are required.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.As a result, there are 896 terminations in total, which does really benefit system on a chip.The system on a chip capability is outstanding just like it is for other high-quality Field Programmable Gate Arrays.Using this SoC chip, you have the option of having 377 outputs.As far as power supplies are concerned, system on chip requires 1.2V.This SoC chip has a total of 377 inputs that can be used.56340 logic cells are included in logic system on chips.The flash is set to 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S050TS-FGG896I System On Chip (SoC) applications.
- Print Special Issue Flyer
- System-on-chip (SoC)
- Measurement testers
- Cyber security for critical applications in the aerospace
- External USB hard disk/SSD
- Communication interfaces ( I2C, SPI )
- USB hard disk enclosure
- Cyberphysical system-on-chip
- Smart appliances
- Microcontroller