M2S060-FCSG325I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Number of Pins | 325 |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Operating Supply Voltage | 1.2V |
| Supply Voltage-Max (Vsup) | 1.26V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.Its package is 325-TFBGA, CSPBGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The system on a chip is part of the series SmartFusion?2.The average operating temps for this SoC meaning should be -40°C~100°C TJ.In addition, this SoC security combines FPGA - 60K Logic Modules.In the state-of-the-art Tray package, this SoC system on a chip is housed.In total, this SoC part has 200 I/Os.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.In the SoCs wireless, voltages above 1.26V are considered unsafe.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Having 325 terminations in total makes system on a chip possible.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.A SoC chip with 200 outputs is available.The logic system on chips contain 56520 logic cells.There is a flash of 256KB.Additionally, this SoC processor features LG-MIN, WD-MIN.There is a 325-pin version of this computer SoC available.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060-FCSG325I System On Chip (SoC) applications.
- Functional safety for critical applications in the aerospace
- Avionics
- Digital Signal Processing
- High-end PLC
- POS Terminals
- ARM
- Cyber security for critical applications in the aerospace
- Embedded systems
- Video Imaging
- AC-input BLDC motor drive
