M2S060-FG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 2 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 387 I/Os.It is advised to utilize a 1.2V power supply.It is unsafe to operate the SoCs wireless at voltages above 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.It is possible to configure FIELD PROGRAMMABLE GATE ARRAY to meet specific needs during the design process.The system on a chip uses 676 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.You can have 387 user outputs for this SoC chip.In order to use system on chip, you will need a power supply of 1.2V.A SoC chip with 387 inputs is available.In logic system on chips, there are 56520 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060-FG676 System On Chip (SoC) applications.
- ARM
- Sensor network-on-chip (sNoC)
- Automotive
- System-on-chip (SoC)
- Smart appliances
- Mouse
- Special Issue Editors
- Efficient hardware for inference of neural networks
- Central alarm system
- Automated sorting equipment
