M2S060T-FG676
| Parameters | |
|---|---|
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is used to build this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.A SoC chip with 64KB RAM is provided for users to enjoy reliable performance.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.Taking note of the fact that this SoC security combines FPGA - 60K Logic Modules is important.Tray package houses this SoC system on a chip.387 I/Os in total are included in this SoC part.A 1.2V power supply is recommended.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.In order to run it, it must be fed by at least 1.14V of power.The FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to meet a variety of design requirements.In total, there are 676 terminations, which makes system on a chip possible.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.The SoC chip that comes with this module can be configured to have 387 outputs.As far as power supplies are concerned, system on chip requires 1.2V.The SoC chip is equipped with 387 inputs.Logic system on chips features 56520 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060T-FG676 System On Chip (SoC) applications.
- Multiprocessor system-on-chips (MPSoCs)
- Apple smart watch
- Digital Signal Processing
- Smartphone accessories
- String inverter
- sequence controllers
- Networked sensors
- Medical Pressure
- Vending machines
- ARM support modules
