M2S060TS-1FGG676T2
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 1 month ago) |
| Package / Case | 676-BGA |
| Supplier Device Package | 676-FBGA (27x27) |
| Operating Temperature | -40°C~125°C TJ |
| Packaging | Tray |
| Series | Automotive, AEC-Q100, SmartFusion®2 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Primary Attributes | FPGA - 60K Logic Modules |
| Flash Size | 256KB |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.The system on a chip is part of the series Automotive, AEC-Q100, SmartFusion?2.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 387 I/Os.There is a flash of 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-1FGG676T2 System On Chip (SoC) applications.
- Temperature
- AC drive control module
- Multiprocessor system-on-chips (MPSoCs)
- Automotive
- Functional safety for critical applications in the automotive
- Personal Computers
- Digital Media
- Temperature Sensors
- Automated sorting equipment
- String inverter
