M2S060TS-FCS325
| Parameters | |
|---|---|
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B325 |
| Number of Outputs | 200 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 200 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 200 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 1.01mm |
| Length | 11mm |
| Width | 11mm |
| RoHS Status | Non-RoHS Compliant |
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor ARM? Cortex?-M3 is embedded in this SoC.According to the manufacturer, this system on a chip has a package of 325-TFBGA, CSPBGA.A 64KB RAM SoC chip provides reliable performance to users.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.One important thing to mark down is that this SoC meaning combines FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.An integral part of this SoC consists of a total of 200 I/Os.A power supply with a 1.2V rating is recommended.For the SoCs wireless, a voltage higher than 1.26V is considered unsafe.If it has at least a 1.14V volt power supply, it can work fine.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.A system on a chip benefits from having 325 terminations.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.This SoC chip is capable of having 200 outputs, which is convenient.A power supply of 1.2V is required to run system on chip.Inputs are available on the SoC chip in the number of 200.The logic system on chips contain 56520 logic cells.It has a 256KB flash.Aside from that, this SoC processor features LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S060TS-FCS325 System On Chip (SoC) applications.
- Wireless sensor networks
- Mouse
- Industrial AC-DC
- Self-aware system-on-chip (SoC)
- Smartphones
- Automotive gateway
- Medical
- Transmitters
- Industrial automation devices
- Automotive
