M2S060TS-FG676
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Published | 2015 |
| Series | SmartFusion®2 |
| JESD-609 Code | e0 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | Tin/Lead (Sn/Pb) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Reach Compliance Code | not_compliant |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 387 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 387 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 387 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 60K Logic Modules |
| Number of Logic Cells | 56520 |
| Flash Size | 256KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.According to the manufacturer, this system on a chip has a package of 676-BGA.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.Typical operating temperatures for this SoC meaning should be 0°C~85°C TJ.A significant feature of this SoC security is the combination of FPGA - 60K Logic Modules.Housed in the state-of-art Tray package.387 I/Os are available in this SoC part.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.It is unsafe to operate the SoCs wireless at voltages above 1.26V.As long as it receives a power supply that is at least 1.14V, it should be able to function.The FIELD PROGRAMMABLE GATE ARRAY can be configured to meet different design requirements.It is really beneficial to have system on a chip since there are 676 terminations in total.Likewise, it has a remarkable system on a chip capability, just like other high-quality Field Programmable Gate Arrays.In order for this SoC chip to work properly, you can have 387 outputs.A power supply of 1.2V is required to run system on chip.The SoC chip offers 387 inputs.Logic system on chips features 56520 logic cells.The flash size of the SoC meaning is 256KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
There are a lot of Microsemi Corporation
M2S060TS-FG676 System On Chip (SoC) applications.
- Automated sorting equipment
- Temperature
- Smart appliances
- Measurement testers
- Cyber security for critical applications in the aerospace
- Functional safety for critical applications in the industrial sectors
- Body control module
- Sensor network-on-chip (sNoC)
- Personal Computers
- Test and Measurement
