M2S090-1FCSG325
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 325-TFBGA, CSPBGA |
| Surface Mount | YES |
| Operating Temperature | 0°C~85°C TJ |
| Packaging | Tray |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 325 |
| Terminal Finish | MATTE TIN |
| Additional Feature | LG-MIN, WD-MIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 0.5mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| JESD-30 Code | R-PBGA-B325 |
| Number of Outputs | 180 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Number of I/O | 180 |
| Speed | 166MHz |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 180 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 1.16mm |
| Length | 13.5mm |
| Width | 11mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 325-TFBGA, CSPBGA by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.This SoC security combines FPGA - 90K Logic Modules and that is something to note.It is packaged in a state-of-the-art Tray package.In total, this SoC part has 180 I/Os.It is advised to utilize a 1.2V power supply.An excessive voltage of 1.26V is considered unsafe for the SoCs wireless, so voltages higher than that are not allowed.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.You can reconfigure FIELD PROGRAMMABLE GATE ARRAY to meet your specific design needs.In total, there are 325 terminations, which is great for system on a chip.In the same way that other high-quality Field Programmable Gate Arrays will do, it is also capable of providing outstanding performance.This SoC chip is capable of having 180 outputs, which is convenient.A power supply of 1.2V is required.A SoC chip with 180 inputs is available.86316 logic cells are present in logic system on chips.This flash has a size of 512KB.Moreover, this SoC processor is also equipped with additional features of LG-MIN, WD-MIN.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
LG-MIN, WD-MIN
There are a lot of Microsemi Corporation
M2S090-1FCSG325 System On Chip (SoC) applications.
- Vending machines
- Mouse
- Industrial AC-DC
- Functional safety for critical applications in the industrial sectors
- Body control module
- Self-aware system-on-chip (SoC)
- Measurement tools
- External USB hard disk/SSD
- Functional safety for critical applications in the aerospace
- Optical drive
