M2S090S-1FGG676I

This SoC is built on ARM? Cortex?-M3 core processor(s).

A core processor ARM? Cortex?-M3 is embedded in this SoC.Package 676-BGA is assigned to this system on a chip by the manufacturer.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.Temperatures should be -40°C~100°C TJ on average for this SoC meaning.This SoC security combines FPGA - 90K Logic Modules, an important feature to keep in mind.An advanced Tray package houses this SoC system on a chip.As a whole, this SoC part is comprised of 425 inputs and outputs.As for its flash size, it is 512KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S090S.A wireless SoC that operates at a frequency of 166MHz is what the wireless SoC does.Based on the core architecture of ARM, the SoC meaning has a high level of performance.-40°C is just enough for the SoC computing to start up.There is a design maximum operating temperature 100°C specified for this SoC system on chip.

ARM? Cortex?-M3 processor.

64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation

M2S090S-1FGG676I System On Chip (SoC) applications.

• Functional safety for critical applications in the aerospace
• Deep learning hardware
• Automotive
• Communication network-on-Chip (cNoC)
• Temperature
• Central alarm system
• Sports
• Measurement testers
• DC-input BLDC motor drive
• Test and Measurement