M2S090T-1FGG676I
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) |
| Package / Case | 676-BGA |
| Surface Mount | YES |
| Operating Temperature | -40°C~100°C TJ |
| Packaging | Tray |
| Published | 2009 |
| Series | SmartFusion®2 |
| JESD-609 Code | e3 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Number of Terminations | 676 |
| Terminal Finish | MATTE TIN |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1.2V |
| Terminal Pitch | 1mm |
| Frequency | 166MHz |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | M2S090T |
| JESD-30 Code | S-PBGA-B676 |
| Number of Outputs | 425 |
| Qualification Status | Not Qualified |
| Supply Voltage-Max (Vsup) | 1.26V |
| Power Supplies | 1.2V |
| Supply Voltage-Min (Vsup) | 1.14V |
| Interface | CAN, Ethernet, I2C, SPI, UART, USART, USB |
| Number of I/O | 425 |
| RAM Size | 64KB |
| Core Processor | ARM® Cortex®-M3 |
| Peripherals | DDR, PCIe, SERDES |
| Connectivity | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
| Architecture | MCU, FPGA |
| Number of Inputs | 425 |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Core Architecture | ARM |
| Primary Attributes | FPGA - 90K Logic Modules |
| Number of Logic Cells | 86316 |
| Flash Size | 512KB |
| Height Seated (Max) | 2.44mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.This system on a chip is packaged as 676-BGA by the manufacturer.As this SoC chip has 64KB RAM implemented, it provides reliable performance to its users.As far as its internal architecture is concerned, this SoC design employs the MCU, FPGA technique.SmartFusion?2 is the series number of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.Tray package houses this SoC system on a chip.425 I/Os are available in this SoC part.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.It is unsafe to operate the SoCs wireless at voltages above 1.26V.There is a possibility that it can be powered by a power supply of at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.system on a chip benefits from 676 terminations.There is no doubt that this system on a chip is outstanding, just as other high-quality Field Programmable Gate Arrays will do.In order for this SoC chip to work properly, you can have 425 outputs.You will need to provide 1.2V power supplies in order to run system on chip.A SoC chip with 425 inputs is available.86316 logic cells are included in logic system on chips.This flash has a size of 512KB.A search for M2S090T will result in system on chips that have similar specs and purposes.wireless SoCs operate at 166MHz.In terms of core architecture, the SoC meaning relies on ARM.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM
There are a lot of Microsemi Corporation
M2S090T-1FGG676I System On Chip (SoC) applications.
- Measurement tools
- Body control module
- Transmitters
- Robotics
- POS Terminals
- Efficient hardware for training of neural networks
- Digital Media
- Smart appliances
- Cyber security for critical applications in the aerospace
- Robotics
