Parameters |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
484-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B484 |
Number of Outputs |
267 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
267 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
267 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
Non-RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.The manufacturer assigns this system on a chip with a 484-BGA package as per the manufacturer's specifications.With 64KB RAM implemented, this SoC chip provides reliable operation.A MCU, FPGA technique is used for the SoC design's internal architecture.In the SmartFusion?2 series, this system on chip SoC is included.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.An integral part of this SoC consists of a total of 267 I/Os.For safe operation, it is advisable to utilize a power supply with 1.2V voltage.The SoCs wireless cannot operate at a voltage greater than 1.26V because it is considered unsafe for the application.As long as it receives a power supply that is at least 1.14V, it should be able to function.Different designing requirements can be met with FIELD PROGRAMMABLE GATE ARRAY.A system on a chip benefits from having 484 terminations.Similar to other high-quality Field Programmable Gate Arrays, it is also endowed with a remarkable system on a chip capability.You can have 267 user outputs for this SoC chip.A power supply of 1.2V is required to run system on chip.There are 267 inputs available on the SoC chip.86316 logic cells are included in logic system on chips.There is a flash of 512KB on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090T-FG484I System On Chip (SoC) applications.
- Functional safety for critical applications in the aerospace
- Smart appliances
- Temperature
- Transmitters
- Central alarm system
- AC drive control module
- External USB hard disk/SSD
- Servo drive control module
- Smartphone accessories
- Automotive gateway