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M2S090TS-FG676

676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V


  • Manufacturer: Microsemi Corporation
  • Nocochips NO: 523-M2S090TS-FG676
  • Package: 676-BGA
  • Datasheet: PDF
  • Stock: 723
  • Description: 676 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 425 I/O1.2V (Kg)

Details

Tags

Parameters
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B676
Number of Outputs 425
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Number of I/O 425
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 425
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Primary Attributes FPGA - 90K Logic Modules
Number of Logic Cells 86316
Flash Size 512KB
Height Seated (Max) 2.44mm
Length 27mm
Width 27mm
RoHS Status Non-RoHS Compliant
Factory Lead Time 1 Week
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Package / Case 676-BGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Published 2015
Series SmartFusion®2
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS

This SoC is built on ARM? Cortex?-M3 core processor(s).


ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Package 676-BGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the SmartFusion?2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 425 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supplies of at least 1.14V are required.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 676 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There is the option to have 425 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 425 inputs is available.86316 logic cells are present in logic system on chips.A flashing 512KB appears on it.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.

There are a lot of Microsemi Corporation


M2S090TS-FG676 System On Chip (SoC) applications.

  • Measurement tools
  • Communication interfaces ( I2C, SPI )
  • Functional safety for critical applications in the automotive
  • Medical
  • Special Issue Editors
  • Digital Media
  • Digital Signal Processing
  • Vending machines
  • Industrial AC-DC
  • Flow Sensors

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