Parameters |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B676 |
Number of Outputs |
425 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
425 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
425 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 90K Logic Modules |
Number of Logic Cells |
86316 |
Flash Size |
512KB |
Height Seated (Max) |
2.44mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
Non-RoHS Compliant |
Factory Lead Time |
1 Week |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
676-BGA |
Surface Mount |
YES |
Operating Temperature |
0°C~85°C TJ |
Packaging |
Tray |
Published |
2015 |
Series |
SmartFusion®2 |
JESD-609 Code |
e0 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
676 |
Terminal Finish |
Tin/Lead (Sn/Pb) |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
This SoC is built on ARM? Cortex?-M3 core processor(s).
ARM? Cortex?-M3 core processor(s) are used in the construction of this SoC.Package 676-BGA is assigned to this system on a chip by the manufacturer.This SoC chip is equipped with 64KB RAM and guarantees reliable performance to the user.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.A system on chip SoC of this type belongs to the SmartFusion?2 series.Temperatures should be 0°C~85°C TJ on average for this SoC meaning.A significant feature of this SoC security is the combination of FPGA - 90K Logic Modules.It is packaged in a state-of-the-art Tray package.This SoC part contains a total of 425 I/Os in total.A power supply with a 1.2V voltage rating should be utilized when using this system on chip SoC.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.Power supplies of at least 1.14V are required.The configuration of FIELD PROGRAMMABLE GATE ARRAY can be adapted to meet the needs of different design projects.system on a chip benefits from 676 terminations.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.There is the option to have 425 outputs on this SoC chip.As far as power supplies are concerned, system on chip requires 1.2V.A SoC chip with 425 inputs is available.86316 logic cells are present in logic system on chips.A flashing 512KB appears on it.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S090TS-FG676 System On Chip (SoC) applications.
- Measurement tools
- Communication interfaces ( I2C, SPI )
- Functional safety for critical applications in the automotive
- Medical
- Special Issue Editors
- Digital Media
- Digital Signal Processing
- Vending machines
- Industrial AC-DC
- Flow Sensors