Parameters |
Lifecycle Status |
IN PRODUCTION (Last Updated: 3 weeks ago) |
Package / Case |
1152-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-55°C~125°C TJ |
Packaging |
Tray |
Series |
SmartFusion®2 |
JESD-609 Code |
e3 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
ECCN Code |
3A001.A.2.C |
Terminal Finish |
MATTE TIN |
HTS Code |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
1.2V |
Terminal Pitch |
1mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B1152 |
Number of Outputs |
574 |
Qualification Status |
Not Qualified |
Supply Voltage-Max (Vsup) |
1.26V |
Power Supplies |
1.2V |
Supply Voltage-Min (Vsup) |
1.14V |
Number of I/O |
574 |
Speed |
166MHz |
RAM Size |
64KB |
Core Processor |
ARM® Cortex®-M3 |
Peripherals |
DDR, PCIe, SERDES |
Connectivity |
CANbus, Ethernet, I2C, SPI, UART/USART, USB |
Architecture |
MCU, FPGA |
Number of Inputs |
574 |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
Primary Attributes |
FPGA - 150K Logic Modules |
Number of Logic Cells |
146124 |
Flash Size |
512KB |
Height Seated (Max) |
2.9mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
RoHS Compliant |
This SoC is built on ARM? Cortex?-M3 core processor(s).
A core processor(s) ARM? Cortex?-M3 is integrated into this SoC.The manufacturer assigns this system on a chip with a 1152-BBGA, FCBGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.This SoC design employs the MCU, FPGA technique for its internal architecture.The SmartFusion?2 series contains this system on chip SoC.The average operating temps for this SoC meaning should be -55°C~125°C TJ.A key point to note is that this SoC security combines FPGA - 150K Logic Modules.It is packaged in a state-of-the-art Tray package.As a whole, this SoC part is comprised of 574 inputs and outputs.It is advised to utilize a 1.2V power supply.In the SoCs wireless, high voltages above 1.26V are considered dangerous and should not be used.Power supply should be at least 1.14V.In order to cater to different design requirements, FIELD PROGRAMMABLE GATE ARRAY can be reconfigured to serve different needs.Just like other high-quality Field Programmable Gate Arrays will do, it is of outstanding system on a chip capability.You can have 574 user outputs for this SoC chip.In order to operate system on chip, you will need 1.2V power supplies.A SoC chip with 574 inputs is available.Logic system on chips features 146124 logic cells.As for its flash size, it is 512KB.
ARM? Cortex?-M3 processor.
64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
There are a lot of Microsemi Corporation
M2S150T-1FCG1152M System On Chip (SoC) applications.
- sequence controllers
- CNC control
- Smartphone accessories
- Mobile market
- Wireless networking
- Optical drive
- Automotive
- Sports
- System-on-chip (SoC)
- Flow Sensors