Parameters |
Mounting Type |
Through Hole |
Package / Case |
16-DIP (0.300, 7.62mm) |
Surface Mount |
NO |
Operating Temperature |
0°C~75°C TA |
Packaging |
Tube |
Series |
10H |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
16 |
Type |
D-Type |
Terminal Finish |
TIN LEAD |
Technology |
ECL |
Voltage - Supply |
-4.9V~-5.46V |
Terminal Position |
DUAL |
Peak Reflow Temperature (Cel) |
240 |
Terminal Pitch |
2.54mm |
Reach Compliance Code |
unknown |
Time@Peak Reflow Temperature-Max (s) |
30 |
Function |
Reset |
Qualification Status |
COMMERCIAL |
Output Type |
Non-Inverted |
Number of Elements |
1 |
Clock Frequency |
250MHz |
Family |
10H |
Current - Quiescent (Iq) |
110mA |
Output Characteristics |
OPEN-EMITTER |
Output Polarity |
TRUE |
Number of Bits per Element |
6 |
Trigger Type |
Positive Edge |
Propagation Delay (tpd) |
3 ns |
fmax-Min |
250 MHz |
Height Seated (Max) |
4.44mm |
RoHS Status |
Non-RoHS Compliant |
MC10H186P Overview
The package is in the form of 16-DIP (0.300, 7.62mm). There is an embedded version in the package Tube. T flip flop uses Non-Invertedas the output. It is configured with a trigger that uses Positive Edge. In this case, the electronic component is mounted in the way of Through Hole. A -4.9V~-5.46Vsupply voltage is required for it to operate. A temperature of 0°C~75°C TAis used in the operation. D-Typedescribes this flip flop. This type of FPGA is a part of the 10H series. You should not exceed 250MHzin its output frequency. D latch consists of 1 elements. There is a consumption of 110mAof quiescent energy. The number of terminations is 16. Electronic devices of this type belong to the 10Hfamily.
MC10H186P Features
Tube package
10H series
MC10H186P Applications
There are a lot of Rochester Electronics, LLC MC10H186P Flip Flops applications.
- Patented noise
- Supports Live Insertion
- Guaranteed simultaneous switching noise level
- Computing
- Common Clocks
- Frequency division
- Memory
- Memory
- CMOS Process
- Automotive