MC33FS4501CAE
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Mounting Type | Surface Mount |
| Package / Case | 48-LQFP Exposed Pad |
| Operating Temperature | -40°C~125°C |
| Packaging | Tray |
| Published | 2017 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Applications | System Basis Chip |
| Voltage - Supply | 1V~5V |
| Peak Reflow Temperature (Cel) | 260 |
| Time@Peak Reflow Temperature-Max (s) | 40 |
| Telecom IC Type | INTERFACE CIRCUIT |
| RoHS Status | ROHS3 Compliant |
MC33FS4501CAE Overview
Using Tray as a shipping the power management path is acceptable.It is packaged the power management in 48-LQFP Exposed Pad for convenient transportation.The Surface Mount mounting method allows for easy adaptation.The power management is intended for use at System Basis Chip as well as other applications.Keeping the operating temperature of the power management ic -40°C~125°C will prevent malfunctions.This power management uses 1V~5V voltage for work.
MC33FS4501CAE Features
Mainly used in System Basis Chip applications
Operating temperature: -40°C~125°C
MC33FS4501CAE Applications
There are a lot of NXP USA Inc. MC33FS4501CAEPower Management applications.
- LTE modem
- SSTL-18 Termination
- Cluster
- In Conjunction With the Internal Feedback E/A of OEM Power Supply Units
- Power Supplies
- Docking station
- Industrial PC
- Electronic Measurement Units
- LP2996A: DDR2
- Industrial applications
