TMS320DM335DZCE135
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 337-LFBGA |
| Supplier Device Package | 337-NFBGA (13x13) |
| Operating Temperature | 0°C~85°C TC |
| Packaging | Tray |
| Series | TMS320DM3x, DaVinci™ |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Type | Digital Media System-on-Chip (DMSoC) |
| Interface | ASP, EBI/EMI, I2C, SPI, UART, USB |
| Voltage - I/O | 1.8V 3.3V |
| Non-Volatile Memory | ROM (8kB) |
| Voltage - Core | 1.30V |
| On Chip Data RAM | 56kB |
| Clock Rate | 135MHz |
| RoHS Status | ROHS3 Compliant |
TMS320DM335DZCE135 Overview
It is a type of electronic component available in package 337-LFBGA.There is a packaging method of Tray provided with it.Its Digital Media System-on-Chip (DMSoC) status makes it ideal for a wide range of applications.In order to mount it, it must be in the direction of Surface Mount.If it is operating at the temperature of 0°C~85°C TC, then it will be operating normally.This refers to the analog voltage range that can be input or output from 1.8V 3.3V.It is a part of the TMS320DM3x, DaVinci? series of digital signal processors.
TMS320DM335DZCE135 Features
Supplied in the 337-LFBGA package
TMS320DM335DZCE135 Applications
There are a lot of Rochester Electronics, LLC TMS320DM335DZCE135 DSP applications.
- Speech processing
- Computers and laptop
- Infrared
- Vehicle electronics
- Processing system
- Statistical signal processing
- Geophysical processing
- Scene analysis technology
- Audio signal
- Other sensor array processing
