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TMS320LBC51PZA

0.5mm 3.3V CPLD 3.3V LQFP


  • Manufacturer: Texas Instruments
  • Nocochips NO: 815-TMS320LBC51PZA
  • Package: LQFP
  • Datasheet: -
  • Stock: 444
  • Description: 0.5mm 3.3V CPLD 3.3V LQFP (Kg)

Details

Tags

Parameters
Package / Case LQFP
Surface Mount YES
Pbfree Code no
Number of Terminations 100
Additional Feature 1K WORDS DATA/PROG RAM
HTS Code 8542.31.00.01
Subcategory Digital Signal Processors
Technology CMOS
Terminal Position QUAD
Terminal Form GULL WING
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Pin Count 100
JESD-30 Code S-PQFP-G100
Qualification Status Not Qualified
Operating Temperature (Max) 85°C
Operating Temperature (Min) -40°C
Supply Voltage-Max (Vsup) 3.47V
Power Supplies 3.3V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3.13V
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, OTHER
Bit Size 16
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FIXED POINT
RAM (words) 544
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Height Seated (Max) 1.6mm
Length 14mm
Width 14mm
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead

TMS320LBC51PZA Overview


It is a type of electronic component available in package LQFP.In terms of its uses, it has 100 terminations.It works with a voltage of 3.3V as a supply voltage.Pins are available for 100 components.This device can be classified into the subcategory Digital Signal Processors based on its specific characteristics.The electric power supply is 3.3V.Electronic parts can also add more features to 1K WORDS DATA/PROG RAM.For its uPs/uCs/peripheral ICs, DIGITAL SIGNAL PROCESSOR, OTHER is used.Operating temperatures should not exceed 85°C.-40°C is the recommended minimum operating temperature.

TMS320LBC51PZA Features


Supplied in the LQFP package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics

TMS320LBC51PZA Applications


There are a lot of Texas Instruments TMS320LBC51PZA DSP applications.

  • Remote sensing image processing technology
  • Signal processing for telecommunications
  • Digital camera
  • Biomedical engineering
  • Financial signals
  • Other sensor array processing
  • Radio detection and rangin systems
  • Digital hardware
  • Medical imaging
  • Biomedical treatment

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