Parameters |
Package / Case |
BGA |
Surface Mount |
YES |
Number of Pins |
256 |
Pbfree Code |
no |
Number of Terminations |
256 |
ECCN Code |
3A001.A.3 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
1.8V |
Terminal Pitch |
1.27mm |
Pin Count |
256 |
Supply Voltage-Max (Vsup) |
1.89V |
Supply Voltage-Min (Vsup) |
1.71V |
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, OTHER |
Clock Frequency |
150MHz |
Address Bus Width |
20 |
Boundary Scan |
YES |
Low Power Mode |
NO |
External Data Bus Width |
32 |
Format |
FIXED POINT |
Barrel Shifter |
NO |
Internal Bus Architecture |
MULTIPLE |
Height Seated (Max) |
2.32mm |
Length |
27mm |
Width |
27mm |
RoHS Status |
RoHS Compliant |
Lead Free |
Contains Lead |
TMS32C6211BGFN150F Overview
It is a type of electronic component available in package BGA.The use of it is terminated by 256.This device is powered by 1.8V's supply voltage.Pins are available for 256 components.There are 256 pins in its configuration.For its uPs/uCs/peripheral ICs, DIGITAL SIGNAL PROCESSOR, OTHER is used.A clock frequency of 150MHz is used to operate it.
TMS32C6211BGFN150F Features
Supplied in the BGA package
DIGITAL SIGNAL PROCESSOR, OTHER as uPs/uCs/Peripheral Ics
TMS32C6211BGFN150F Applications
There are a lot of Texas Instruments TMS32C6211BGFN150F DSP applications.
- Seismology
- Processing system
- 3D tomography and imaging processing
- Instrument modeling
- Streaming music
- Video coding, audio coding
- Smart phones
- Automobile electronic gadgets
- MP3 audio player
- Electronic information engineering