X66AK2H70XAAW24
| Parameters | |
|---|---|
| Package / Case | BGA |
| Part Status | Discontinued |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | 0°C |
| Base Part Number | 66AK2H70 |
| Interface | I2C, SPI, UART |
| Max Supply Voltage | 1.1V |
| Min Supply Voltage | 800mV |
| Memory Size | 4MB |
| Number of I/O | 32 |
| RAM Size | 32kB |
| Number of Timers/Counters | 20 |
| Core Architecture | ARM |
| Max Frequency | 1.4GHz |
| Number of Programmable I/O | 32 |
| Height | 800μm |
| Length | 38mm |
| Width | 38mm |
| RoHS Status | Non-RoHS Compliant |
X66AK2H70XAAW24 Overview
An electronic component available in package BGA.It is possible to identify numerous related parts using the base part number 66AK2H70.This device operates at a voltage as low as 800mV.It is capable of receiving a maximum voltage of 1.1V.4MB data can be stored in the memory of this device.Timer/counters for measuring and counting external events are called 20 timers or counters.The processor core uses the architecture of the ARM processor.32 I/Os are included with the device.It is recommended to keep the operating temperature below 85°C.Temperatures should exceed 0°C during operation.Keeping the frequency below 1.4GHz will ensure reliability.A 32 programmable I/O is used for data transmission.
X66AK2H70XAAW24 Features
Supplied in the BGA package
20 timers/counters
32 I/Os
X66AK2H70XAAW24 Applications
There are a lot of Texas Instruments X66AK2H70XAAW24 DSP applications.
- Consumer electronic gadgets
- Receivers
- Speech processing and recognition
- Automobile electronic gadgets
- Encoding/broadcast
- 3D tomography and imaging processing
- Biometrics
- Monitoring equipment
- Speech processing
- Image compression
