Parameters |
Factory Lead Time |
1 Week |
Contact Plating |
Copper, Silver, Tin |
Mount |
Surface Mount |
Package / Case |
484-LFBGA, CSPBGA |
Number of Pins |
484 |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Published |
2009 |
Series |
Automotive, AEC-Q100, Zynq®-7000 XA |
JESD-609 Code |
e1 |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
484 |
ECCN Code |
3A991.D |
Terminal Finish |
TIN SILVER COPPER |
HTS Code |
8542.39.00.01 |
Subcategory |
Other uPs/uCs/Peripheral ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Terminal Pitch |
0.8mm |
Frequency |
667MHz |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
Qualification Status |
Not Qualified |
Operating Supply Voltage |
1V |
Power Supplies |
11.8V |
Interface |
CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB |
Number of I/O |
130 |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Data Bus Width |
32b |
Core Architecture |
ARM |
Primary Attributes |
Artix™-7 FPGA, 85K Logic Cells |
UV Erasable |
N |
Height Seated (Max) |
1.6mm |
Length |
19mm |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
A core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight? is integrated into this SoC.Manufacturer assigns package 484-LFBGA, CSPBGA to this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 256KB RAM.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series Automotive, AEC-Q100, Zynq?-7000 XA.This SoC meaning should have an average operating temperature of -40°C~125°C TJ.This SoC security combines Artix?-7 FPGA, 85K Logic Cells and that is something to note.A state-of-the-art Tray package houses this SoC system on a chip.This SoC part has a total of 130 I/Os.It is really beneficial to have system on a chip since there are 484 terminations in total.As any high-quality Other uPs/uCs/Peripheral ICs, it is a system on a chip of outstanding capabilities.As far as power supplies are concerned, system on chip requires 11.8V.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.During operation, the wireless SoC runs at a frequency of 667MHz.In order to operate the SoC meaning, it must be based on the core architecture of ARM.The computer SoC has 484 pins.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
Core Architecture: ARM
There are a lot of Xilinx Inc.
XA7Z020-1CLG484Q System On Chip (SoC) applications.
- Sensor network-on-chip (sNoC)
- Industrial automation devices
- Communication network-on-Chip (cNoC)
- Industrial robot
- Samsung galaxy gear
- Functional safety for critical applications in the industrial sectors
- Robotics
- Efficient hardware for inference of neural networks
- High-end PLC
- sequence controllers