Parameters |
Package / Case |
484-BBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~100°C TJ |
Packaging |
Tray |
Published |
2010 |
Series |
Automotive, AEC-Q100, Zynq®-7000 XA |
JESD-609 Code |
e1 |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
484 |
ECCN Code |
EAR99 |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
Subcategory |
Other uPs/uCs/Peripheral ICs |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
250 |
Terminal Pitch |
1mm |
Reach Compliance Code |
not_compliant |
Time@Peak Reflow Temperature-Max (s) |
30 |
JESD-30 Code |
S-PBGA-B484 |
Qualification Status |
Not Qualified |
Power Supplies |
11.8V |
Number of I/O |
130 |
Speed |
667MHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
Peripherals |
DMA |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Kintex™-7 FPGA, 125K Logic Cells |
UV Erasable |
N |
Height Seated (Max) |
2.54mm |
Length |
23mm |
Width |
23mm |
RoHS Status |
RoHS Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.Assigned with the package 484-BBGA, FCBGA, this system on a chip comes from the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.The Automotive, AEC-Q100, Zynq?-7000 XA series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.The system on a chip uses 484 terminations in total.Just like other high-quality Other uPs/uCs/Peripheral ICs will do, it is of outstanding system on a chip capability.There is 11.8V power supply requirement for this system on chip SoC.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XA7Z030-1FBG484I System On Chip (SoC) applications.
- Body control module
- Vending machines
- Keywords
- Smart appliances
- Wireless sensor networks
- Measurement tools
- Special Issue Information
- Digital Media
- DC-input BLDC motor drive
- POS Terminals