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XA7Z030-1FBG484I

484 Terminations-40°C~100°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XA7Z030-1FBG484I
  • Package: 484-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 641
  • Description: 484 Terminations-40°C~100°C TJ System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O(Kg)

Details

Tags

Parameters
Package / Case 484-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Published 2010
Series Automotive, AEC-Q100, Zynq®-7000 XA
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 484
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Subcategory Other uPs/uCs/Peripheral ICs
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Terminal Pitch 1mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B484
Qualification Status Not Qualified
Power Supplies 11.8V
Number of I/O 130
Speed 667MHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
UV Erasable N
Height Seated (Max) 2.54mm
Length 23mm
Width 23mm
RoHS Status RoHS Compliant

This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).


Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC has been developed.Assigned with the package 484-BBGA, FCBGA, this system on a chip comes from the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.This SoC design employs the MCU, FPGA technique for its internal architecture.The Automotive, AEC-Q100, Zynq?-7000 XA series contains this system on chip SoC.It is recommended that this SoC meaning be operated at -40°C~100°C TJ on an average.Taking note of the fact that this SoC security combines Kintex?-7 FPGA, 125K Logic Cells is important.This SoC system on a chip has been designed in a state-of-the-art Tray package.130 I/Os in total are included in this SoC part.The system on a chip uses 484 terminations in total.Just like other high-quality Other uPs/uCs/Peripheral ICs will do, it is of outstanding system on a chip capability.There is 11.8V power supply requirement for this system on chip SoC.MICROPROCESSOR CIRCUIT served as its uPs, uCs, and peripheral integrated circuits.

Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT

There are a lot of Xilinx Inc.


XA7Z030-1FBG484I System On Chip (SoC) applications.

  • Body control module
  • Vending machines
  • Keywords
  • Smart appliances
  • Wireless sensor networks
  • Measurement tools
  • Special Issue Information
  • Digital Media
  • DC-input BLDC motor drive
  • POS Terminals

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