Parameters |
Factory Lead Time |
1 Week |
Package / Case |
625-BFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~125°C TJ |
Packaging |
Tray |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
625 |
HTS Code |
8542.31.00.01 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
Supply Voltage |
0.85V |
Terminal Pitch |
0.8mm |
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED |
JESD-30 Code |
S-PBGA-B625 |
Number of I/O |
128 |
Speed |
500MHz, 1.2GHz |
RAM Size |
1.2MB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, I2C, SPI, UART/USART, USB |
Architecture |
MPU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Height Seated (Max) |
3.43mm |
Length |
21mm |
Width |
21mm |
RoHS Status |
ROHS3 Compliant |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A core processor Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 is used to build this SoC.There is a 625-BFBGA, FCBGA package assigned to this system on a chip by the manufacturer.With 1.2MB RAM implemented, this SoC chip provides users with a high level of performance.Internally, this SoC design uses the MPU, FPGA technique.It is a member of the Zynq? UltraScale+? MPSoC EG series.This SoC meaning should have an average operating temperature of -40°C~125°C TJ when it is operating normally.In addition, this SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells.A state-of-the-art Tray package houses this SoC system on a chip.128 I/Os are included in this SoC part.A 0.85V power supply should be used.In total, there are 625 terminations, which is great for system on a chip.MICROPROCESSOR CIRCUIT is used for its uPs, uCs, and peripheral SoCs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XAZU2EG-1SFVA625Q System On Chip (SoC) applications.
- String inverter
- Industrial AC-DC
- RISC-V
- Wireless sensor networks
- Special Issue Editors
- Deep learning hardware
- Test and Measurement
- Robotics
- Healthcare
- Temperature Sensors