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XAZU2EG-L1SFVC784I

784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XAZU2EG-L1SFVC784I
  • Package: 784-BFBGA, FCBGA
  • Datasheet: PDF
  • Stock: 924
  • Description: 784 Terminations-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 128 I/O0.72V (Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 784
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Number of I/O 128
Speed 500MHz, 1.2GHz
RAM Size 1.2MB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, I2C, SPI, UART/USART, USB
Architecture MPU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
Height Seated (Max) 3.32mm
Length 23mm
Width 23mm
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 784-BFBGA, FCBGA package as per the manufacturer's specifications.The 1.2MB RAM implementation of this SoC chip ensures efficient performance for users.In terms of internal architecture, this SoC design uses the MPU, FPGA method.The Zynq? UltraScale+? MPSoC EG series contains this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.It is important to note that this SoC security combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.Tray package houses this SoC system on a chip.This SoC part has a total of 128 I/Os.For safe operation, it is advisable to utilize a power supply with 0.72V voltage.In total, there are 784 terminations, so system on a chip is really aided by this.MICROPROCESSOR CIRCUIT is its uPs/uCs/peripheral IC and is used in all of its peripheral SoC meanings.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


1.2MB RAM.
Built on MPU, FPGA.
MICROPROCESSOR CIRCUIT

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XAZU2EG-L1SFVC784I System On Chip (SoC) applications.

  • Vending machines
  • Industrial robot
  • Cyberphysical system-on-chip
  • Transmitters
  • Servo drive control module
  • Published Paper
  • Sports
  • Vending machines
  • Smart appliances
  • Wireless sensor networks

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