XC7K70T-3FBG676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Contact Plating | Copper, Silver, Tin |
| Mounting Type | Surface Mount |
| Package / Case | 676-BBGA, FCBGA |
| Surface Mount | YES |
| Number of Pins | 676 |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2010 |
| Series | Kintex®-7 |
| JESD-609 Code | e1 |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of Terminations | 676 |
| ECCN Code | 3A991.D |
| Terminal Finish | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
| HTS Code | 8542.39.00.01 |
| Subcategory | Field Programmable Gate Arrays |
| Technology | CMOS |
| Voltage - Supply | 0.97V~1.03V |
| Terminal Position | BOTTOM |
| Terminal Form | BALL |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Supply Voltage | 1V |
| Terminal Pitch | 1mm |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Base Part Number | XC7K70T |
| Pin Count | 676 |
| Number of Outputs | 300 |
| Qualification Status | Not Qualified |
| Power Supplies | 11.83.3V |
| Number of I/O | 300 |
| RAM Size | 607.5kB |
| Clock Frequency | 1412MHz |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY |
| Number of Logic Elements/Cells | 65600 |
| Total RAM Bits | 4976640 |
| Number of LABs/CLBs | 5125 |
| Speed Grade | -3 |
| Number of Registers | 82000 |
| Combinatorial Delay of a CLB-Max | 0.58 ns |
| Height Seated (Max) | 2.54mm |
| Length | 27mm |
| Width | 27mm |
| RoHS Status | ROHS3 Compliant |
XC7K70T-3FBG676E Overview
Fpga chips is supplied in the 676-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 300 I/Os are programmed to ensure a more coherent data transfer. A fundamental building block is made up of 65600 logic elements/cells. The supply voltage is 1V volts. FPGA parts like this belong to the Field Programmable Gate Arrays family. This FPGA module can be attached to the development board with a Surface Mount. Powered by a 0.97V~1.03V supply voltage, fpga chips is able to operate at high speeds. As part of the Kintex?-7 series of FPGAs, it is a type of FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~100°C TJ at all times. The device has 300 outputs that are integrated into it. In order to save space, this FPGA model has been contained in Tray. In total, it has a total of 676 terminations. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 4976640 bFpga chipss. Related parts can be found by using its base part number XC7K70T. For the program to work properly, the RAM si607.5kBe of this FPGA module must reach 607.5kB GB in order to ensure normal operation. 676 pins are designed into the device. Fpga electronics contains 5125 LABs/CLBs in an array. It is powered by a 11.83.3V battery, which can be purchased separately. In addition to this, it has 676 pins. Typically, fpga semiconductor uses a crystal oscillating at 1412MHz . A total of 82000 registers are used for storing and transferring data between them.
XC7K70T-3FBG676E Features
300 I/Os
Up to 4976640 RAM bits
676 LABs/CLBs
82000 registers
XC7K70T-3FBG676E Applications
There are a lot of Xilinx Inc. XC7K70T-3FBG676E FPGAs applications.
- Medical Electronics
- Digital signal processing
- Industrial IoT
- Data center hardware accelerators
- Data center search engines
- Scientific Instruments
- High Performance Computing
- Defense Applications
- Space Applications
- Electronic Warfare
