XC7Z045-3FFV676E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 676-BBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Bulk |
| Published | 2009 |
| Series | Zynq®-7000 |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Number of I/O | 130 |
| Speed | 1GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ |
| Peripherals | DMA |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A9 MPCore? with CoreSight? core processor(s).
Based on the core processor(s) Dual ARM? Cortex?-A9 MPCore? with CoreSight?, this SoC is built.According to the manufacturer, this system on a chip has a package of 676-BBGA, FCBGA.A SoC chip with 256KB RAM is provided for users to enjoy reliable performance.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The Zynq?-7000 series contains this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~100°C TJ on an average.There is one thing to note about this SoC security: it combines Kintex?-7 FPGA, 350K Logic Cells.There is a state-of-the-art Bulk package that houses this SoC system on a chip.This SoC part contains a total of 130 I/Os in total.
Dual ARM? Cortex?-A9 MPCore? with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XC7Z045-3FFV676E System On Chip (SoC) applications.
- Functional safety for critical applications in the industrial sectors
- Sports
- Measurement testers
- Transmitters
- Robotics
- Special Issue Information
- Communication interfaces ( I2C, SPI )
- Smart appliances
- Flow Sensors
- Vending machines
