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XCZU11EG-L2FFVC1156E

0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O0.72V


  • Manufacturer: Xilinx Inc.
  • Nocochips NO: 903-XCZU11EG-L2FFVC1156E
  • Package: 1156-BBGA, FCBGA
  • Datasheet: PDF
  • Stock: 149
  • Description: 0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O0.72V (Kg)

Details

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Parameters
Factory Lead Time 1 Week
Package / Case 1156-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~100°C TJ
Packaging Tray
Published 2016
Series Zynq® UltraScale+™ MPSoC EG
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Additional Feature ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
HTS Code 8542.31.00.01
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.72V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PBGA-B1156
Supply Voltage-Max (Vsup) 0.742V
Supply Voltage-Min (Vsup) 0.698V
Number of I/O 360
Speed 533MHz, 600MHz, 1.3GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
RoHS Status ROHS3 Compliant

This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).


This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).According to the manufacturer, this system on a chip has a package of 1156-BBGA, FCBGA.The 256KB RAM implementation of this SoC chip ensures efficient performance for users.The internal architecture of this SoC design is based on the MCU, FPGA technique.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~100°C TJ.A key point to note is that this SoC security combines Zynq?UltraScale+? FPGA, 653K+ Logic Cells.Housed in the state-of-art Tray package.As a whole, this SoC part includes 360 I/Os.A power supply with a 0.72V rating is recommended.For the SoCs wireless, a voltage higher than 0.742V is considered unsafe.Power supplies of at least 0.698V are required.For its uPs/uCs/peripheral SoCs, it uses MICROPROCESSOR CIRCUIT.This SoC processor also includes ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY.

Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.


256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY

There are a lot of Xilinx Inc.


XCZU11EG-L2FFVC1156E System On Chip (SoC) applications.

  • Temperature Sensors
  • Video Imaging
  • String inverter
  • ARM
  • Digital Media
  • Servo drive control module
  • Vending machines
  • Vending machines
  • Functional safety for critical applications in the industrial sectors
  • Industrial robot

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