Parameters |
Package / Case |
484-BFBGA, FCBGA |
Surface Mount |
YES |
Operating Temperature |
0°C~100°C TJ |
Packaging |
Tray |
Published |
2013 |
Series |
Zynq® UltraScale+™ MPSoC EG |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
Number of Terminations |
484 |
Technology |
CMOS |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Supply Voltage |
0.9V |
Reach Compliance Code |
compliant |
JESD-30 Code |
S-PBGA-B484 |
Number of I/O |
82 |
Speed |
600MHz, 667MHz, 1.5GHz |
RAM Size |
256KB |
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR CIRCUIT |
Core Processor |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Peripherals |
DMA, WDT |
Connectivity |
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |
Primary Attributes |
Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
This SoC is built on Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s).
A Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 core processor(s) is built into this SoC.Its package is 484-BFBGA, FCBGA.With 256KB RAM implemented, this SoC chip provides reliable operation.In terms of internal architecture, this SoC design uses the MCU, FPGA method.In the Zynq? UltraScale+? MPSoC EG series, this system on chip SoC is included.Typical operating temperatures for this SoC meaning should be 0°C~100°C TJ.This SoC security combines Zynq?UltraScale+? FPGA, 103K+ Logic Cells, an important feature to keep in mind.There is a state-of-the-art Tray package that houses this SoC system on a chip.This SoC part contains a total of 82 I/Os in total.It is recommended to use a 0.9V power supply.There are 484 terminations in total and that really benefits system on a chip.This wireless SoC uses MICROPROCESSOR CIRCUIT as its uPs, uCs, and peripheral ICs.
Quad ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight?, ARM Mali?-400 MP2 processor.
256KB RAM.
Built on MCU, FPGA.
MICROPROCESSOR CIRCUIT
There are a lot of Xilinx Inc.
XCZU2EG-3SBVA484E System On Chip (SoC) applications.
- DC-input BLDC motor drive
- System-on-chip (SoC)
- POS Terminals
- Medical Pressure
- Cyber security for critical applications in the aerospace
- Level
- Multiprocessor system-on-chips (MPSoCs)
- Industrial Pressure
- Avionics
- ARM processors