XCZU3CG-2SBVA484E
| Parameters | |
|---|---|
| Factory Lead Time | 1 Week |
| Package / Case | 484-BFBGA, FCBGA |
| Operating Temperature | 0°C~100°C TJ |
| Packaging | Tray |
| Published | 2016 |
| Series | Zynq® UltraScale+™ MPSoC CG |
| Pbfree Code | yes |
| Part Status | Active |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| HTS Code | 8542.31.00.01 |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
| Number of I/O | 82 |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Peripherals | DMA, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Architecture | MCU, FPGA |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| RoHS Status | ROHS3 Compliant |
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).
This SoC is built on Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? core processor(s).Assigned with the package 484-BFBGA, FCBGA, this system on a chip comes from the manufacturer.As this SoC chip has 256KB RAM implemented, it provides reliable performance to its users.In terms of internal architecture, this SoC design uses the MCU, FPGA method.The Zynq? UltraScale+? MPSoC CG series contains this system on chip SoC.This SoC meaning should have an average operating temperature of 0°C~100°C TJ.There is one thing to note about this SoC security: it combines Zynq?UltraScale+? FPGA, 154K+ Logic Cells.An advanced Tray package houses this SoC system on a chip.This SoC part has a total of 82 I/Os.
Dual ARM? Cortex?-A53 MPCore? with CoreSight?, Dual ARM?Cortex?-R5 with CoreSight? processor.
256KB RAM.
Built on MCU, FPGA.
There are a lot of Xilinx Inc.
XCZU3CG-2SBVA484E System On Chip (SoC) applications.
- Mobile market
- Automotive
- Keyboard
- Vending machines
- Automated sorting equipment
- Samsung galaxy gear
- Functional safety for critical applications in the aerospace
- Cyberphysical system-on-chip
- Cyber security for critical applications in the aerospace
- Communication interfaces ( I2C, SPI )
